Lenovo W541 Informacje Techniczne Strona 98

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Note:Droppingasystemboardfromaheightofaslittleas6inchessothatitfallsflatonahardbench
cansubjecttheaccelerometertoasmuchas6000G'sofshock.
Becarefulnottodropthesystemboardonabenchtopthathasahardsurface,suchasmetal,wood,or
composite.
Avoidroughhandlingofanykind.
Ateverypointintheprocess,besurenottodroporstackthesystemboard.
Ifyouputasystemboarddown,besuretoputitonlyonapaddedsurfacesuchasanESDmatora
corrugatedconductivematerial.
Foraccess,removetheseFRUsinorder:
“1010Batterypack”onpage58
“1030Largebottomdoor”onpage60
“1110Keyboard”onpage68
“1120Keyboardbezelassembly”onpage73
“1150LCDunit”onpage82
“1160Magnesiumstructureframe”onpage85
“1170Speakerassembly”onpage86
“1190Thermalfanassembly”onpage88
“1200USBcard”onpage90
Thefollowingcomponentssolderedonthetopsideofthesystemboardisextremelysensitive.Whenyou
servicethesystemboard,avoidanykindofroughhandling.
aMicroprocessor
bGraphicProcessingUnit(GPU)
cAccelerometerchipfortheharddiskdriveActiveProtectionSystem
®
(APS)
dPlatformControllerHub(PCH)
Note:GPUisonlyformodelsthathaveadiscretegraphicscard.
a
b
c
92HardwareMaintenanceManual
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R 12 Mar 2025 | 05:44:50

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